Blog Layout

The Importance of Wafer Coring in Semiconductor Manufacturing

The Wafer Coring Process at APD

Wafer Coring


In the semiconductor industry, adapting to evolving technologies and equipment is crucial. At American Precision Dicing, Inc. (APD), we specialize in wafer coring, a process essential for resizing wafers to fit specific processing equipment. This blog post delves into the intricacies of wafer coring, its significance, and why APD is your trusted partner for this critical service.

What is Wafer Coring?
Wafer coring, also known as wafer resizing, involves reducing the diameter of a wafer to fit the available processing equipment. This process ensures that older, expensive tooling remains usable despite changes in wafer sizes.


The Wafer Coring Process


  1. Preparation: A protective layer is applied to the wafer to prevent surface damage.
  2. Grinding: Wafers are ground to the required thickness if necessary.
  3. Custom Programming: A custom coring program is created based on specific customer requirements.
  4. Coring: The wafers are resized using mechanical sawing processes.
  5. Edge Beveling: Resized wafers are edge-rounded to enhance mechanical stability.
  6. Inspection: Detailed inspections ensure quality and precision.
  7. Cleaning and Packaging: The protective layer is removed, and the wafers undergo a thorough cleaning before packaging and shipment.


Why Choose Mechanical Coring Over Laser?
Mechanical coring offers flexibility in handling various hard and brittle materials such as silicon, glass, and sapphire. Unlike lasers, mechanical cutting does not require adjustments based on the material's properties, making it more versatile and cost-effective.

Flats and Notches

Wafer flats and notches are critical for alignment and indicate the wafer's crystal orientation. Maintaining these features during coring is essential for the integrity of the wafer's function and alignment in subsequent processes.

Advanced Capabilities
At APD, we handle wafers up to 300mm in diameter, resizing them to standard sizes such as 2", 3", 4", 6", 8", and 12". Our expertise extends to various materials, ensuring precise and reliable resizing for both patterned and blank wafers.

Why APD?
Choosing APD means partnering with a company that values precision, reliability, and customer satisfaction. Our comprehensive wafer coring services, advanced capabilities, and dedication to excellence make us the ideal choice for your semiconductor manufacturing needs.

Conclusion
Wafer coring is a critical component in semiconductor manufacturing, enabling the continued use of existing processing equipment despite changes in wafer sizes. At APD, we excel in providing high-quality, precise wafer coring services tailored to your specific requirements. Contact us today to learn more about our wafer coring services and how we can support your manufacturing processes.

For more detailed information, visit our
Wafer Coring Service Page.

Die Sort, Pick, Place, and Labeling Inspection
August 26, 2024
This blog post details APD's comprehensive die sort, pick, place, and labeling services, emphasizing their critical role in the semiconductor manufacturing process. It covers the benefits of each service and explains how APD’s advanced technologies ensure precise, efficient, and reliable outcomes for various applications.
Wafer Dicing Machine
August 26, 2024
This blog post highlights APD's capabilities in dicing 300mm wafers, emphasizing the economic advantages of larger wafers in semiconductor manufacturing. It covers the services APD provides, including mounting, dicing, inspection, and more, and explains why APD is a preferred choice for clients needing precise and efficient wafer dicing.
Custom Precision Spacers and Shims by APD: Tailored Prototyping Solutions
August 26, 2024
This blog focuses on APD's custom precision spacers and shims, designed to meet specific client requirements. It discusses the benefits of using APD’s turnkey services, which include custom sizing, coatings, and laser markings, and how they streamline the production process, saving time and money.
PCB - Printed Circuit Board
August 26, 2024
This post offers a thorough overview of various PCB depaneling methods, including laser depaneling, die-punching, hand depaneling, and wafer dicing saws. It discusses the advantages and applications of each method, helping readers understand how to choose the right approach for their specific PCB manufacturing needs.
Laser Marking Banner
August 19, 2024
This blog outlines the laser marking services offered by APD, detailing their applications across various industries. It explains how APD's advanced laser technology provides precise, durable, and customizable markings on a wide range of materials, including metals, ceramics, and semiconductors. The post emphasizes the benefits of laser marking, such as high resistance to wear and corrosion, making it an ideal solution for product identification and traceability.
Photoresist Application
August 12, 2024
This blog post explores APD’s expertise in photoresist application, a crucial step in wafer processing for semiconductor manufacturing. It explains the importance of photoresist in protecting wafer surfaces during etching and other processes, highlighting APD's commitment to precision and quality in every step. The post also covers the types of materials handled and the advanced techniques used to ensure optimal results.
Wafer Dicing Machine cutting a wafer
July 3, 2024
This blog explores the intricate process of wafer dicing at American Precision Dicing, Inc. (APD). It delves into the meticulous steps involved, from material preparation to quality assurance, highlighting APD's expertise in handling various hard and brittle materials. The post also emphasizes APD's commitment to speed, value, and flexibility, making them a trusted partner in semiconductor manufacturing.
Share by: