featured PROJECT #1
Nanotechnology
Micromachining of Nitinol Wire: We specialize in the micromachining of 75-micron thick Nitinol wire, precisely cutting it into 1.8 mm lengths. Each piece features three notches: two on one side and one on the opposite side. These notches are 38 microns deep and 175 microns wide, showcasing our precision capabilities.
Micromachining of Nitinol Springs and Tubes:
We also offer micromachining services for various sizes of Nitinol springs and tubes, ensuring exacting standards are met for your nanotechnology needs.
featured PROJECT #2
Semiconductors
Zero-Tack Tape Dicing:
We deliver precisely cut silicon pieces on zero-tack tape, facilitating seamless integration into automatic pick-and-place processes.
Singulation of Fragile Die Pieces:
Our expertise includes the singulation of die pieces with very fragile bumps, ensuring careful handling and precision.
Cutting Thin Wafers:
We specialize in cutting and picking die pieces from wafers as thin as 50 microns, maintaining accuracy and integrity
featured PROJECT #3
Photonics / Optics
Quartz Photomask Sawing:
We provide precise sawing services for 1/4" thick quartz photomasks, ensuring clean and accurate cuts.
Specialized Sawing for Silicon/Pyrex:
Using a special blade, we saw Silicon/Pyrex material to provide an 8-degree sidewall, tailored to specific optical requirements
Near Polished Cuts: Our "near polished" cuts eliminate the need for a polishing step, streamlining the process for our end customers.
featured PROJECT #4
Other Services
High Aspect Ratio Cuts in Ferrite Toroids:
We place high aspect ratio cuts in Ferrite toroids, achieving cuts that are 50 microns wide and 3.25 mm deep, demonstrating our precision and depth capabilities.
Precision Routing of Small PCBs:
We offer precision routing for very small printed circuit boards from panels, ensuring accuracy and maintaining the integrity of delicate components.
