Nanotechnology
- Micromachining of 75 micron thick Nitinol wire. The wire was cut into 1.8 mm lengths and 3 notches were cut into the sides of the piece. The notches were 38 microns deep and 175 microns wide with 2 notches placed on the opposite side from the third.
- Micromachining of various sizes of Nitinol springs and tubes.
Semiconductor
- Delivering cut silicon pieces on zero-tack tape to facilitate an automatic pick and place process.
- Singulation of die pieces with very fragile bumps.
- Cutting and picking of die pieces from a 50 micron thick wafer.
Photonics/Optics
- Sawing of 1/4" thick quartz photomask.
- Sawing Silicon/Pyrex material with a special blade to provide an 8 degree sidewall.
- Providing "near Polished" cuts to eliminate a polishing step for the end customer.
Other
- Placing high aspect ratio cuts in Ferrite toroids. (50 microns wide and 3.25 mm deep).
- Precision routing of very small printed circuit boards from panels.
