PCB Depanelization Services

At American Precision Dicing (APD), we specialize in PCB depanelization, also known as PCB depaneling, PCB cutting or PCB dicing. This critical process involves singulating individual printed circuit boards (PCBs) from a larger manufacturing panel while preserving their structural integrity and functionality.

Understanding PCB Depanelization

In modern electronics manufacturing, multiple PCBs are fabricated on a single panel to improve efficiency and streamline production. Depanelization is the process of separating these boards for integration into finished products. This requires high precision to prevent stress, damage, or component misalignment—especially as electronic designs become increasingly compact and delicate.

PCB DEPANELIZATION / cutting SERVICE

Our Depanelization Method

At APD, we utilize wafer dicing saws for PCB depanelization, ensuring precise separation with minimal material loss. Unlike traditional mechanical cutting methods, which can introduce excessive stress and consume more material due to wide kerf sizes, our advanced dicing saws enable ultra-precise cuts with minimal kerf loss. This makes them particularly effective for high-density interconnect (HDI) PCBs, rigid PCBs, and flex-rigid PCBs commonly made from FR-4 and other advanced substrates.


Advantages of Wafer Dicing Saw Depanelization:

Ultra-Thin Kerf Widths: Our saws produce narrower cuts compared to conventional methods, preserving valuable material.

High Precision & Clean Edges: Ideal for complex PCB layouts, reducing chipping and burr formation.


Low Mechanical Stress: Unlike mechanical routers or scoring methods, wafer dicing minimizes stress, protecting sensitive electronic components.


Material Versatility: Our PCB depaneling process is optimized for FR-4-based PCBs, high-frequency PCB substrates, and rigid-flex boards with delicate layers.

Why Choose APD for your PCB Depanelization Needs?

Proven Expertise:  Decades of experience delivering precision PCB depanelization services for diverse applications.


Material Efficiency: Our wafer dicing saws minimize waste, improving your production yield.

Customized Solutions:  We tailor our PCB depanelization process to meet your specific project needs.

Fast-Turn Services:  With standard, expedited, and same-day turnaround options, we keep your production schedules on track.

Get Started Today


For reliable, precise, and efficient PCB depanelization services, trust APD to meet your manufacturing needs. Whether working with FR-4, ceramic, or other specialized substrates, we deliver quality and speed to help you achieve your production goals. Contact us or Request a Quote today to discuss your project requirements.