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Get in Touch with Us

Whether you have questions, need a quote, or want to discuss how APD’s precise wafer dicing, wafer coring and other professional services can support your project, we’re here to help. Our team is ready to provide expert guidance and fast responses to meet your unique needs. Please reach out using the contact details below or fill out our Request a Quote form for personalized assistance.

sales@wafer-dicing.com

Email

You can email us anytime, and our team will respond promptly.

408-539-9880

Phone

Call us during business hours to discuss your project needs or to get more information about our services.

642 Giguere Ct, San Jose, CA 95133 U.S.A

Office

Visit us at our office for a face-to-face consultation or to discuss your project requirements.

Company Overview

APD is a fast turn wafer dicing service that has been providing services since 1999. We use precision mechanical dicing saws with diamond dicing blades to dice and machine a large variety of wafers made of various types and combinations of hard brittle materials.

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What We Do
Wafer Dicing Service
Wafer Coring
Laser Marking
Die Sort, Pick & Place, and Labeling
Photoresist
Wafer Backgrinding
Wafer Acquisition
About Us
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