At APD, we offer a comprehensive range of professional services tailored to meet your specific needs. Our in-house developed processes leverage our extensive expertise and cutting-edge technology to ensure superior quality and precision. Additionally, we collaborate with trusted long-time partners to provide managed services that extend our capabilities and deliver exceptional results.
At APD, our in-house processes are the cornerstone of our commitment to delivering exceptional quality and precision. Developed with our specialized expertise, these proprietary techniques ensure that each step of wafer processing is executed with meticulous attention to detail. From advanced wafer dicing and photoresist application to die sorting, picking, placing, and labeling, our in-house services are designed to meet the specific needs of our clients. Our state-of-the-art facilities and dedicated team allow us to continuously refine our processes, guaranteeing reliable and efficient solutions for a wide range of applications
At APD, wafer dicing is not just our core competency; it's our passion. We employ cutting-edge dicing technologies to deliver unparalleled precision and quality. Our experienced team expertly handles a variety of materials, ensuring minimal damage and maximum yield. Whether for semiconductor, photonics, or MEMS applications, we guarantee optimal results and consistent quality for all your wafer dicing needs.
Resizing a wafer to reduce its diameter, or coring, often requires additional processing. APD specializes in precise wafer coring services to meet your specific dimensions. Our expertise ensures minimal material loss and optimal quality, making the wafers suitable for further processing and integration. We handle each wafer with precision to achieve the desired size without compromising structural integrity.
APD's laser marking process uses state-of-the-art lasers to etch serial numbers and other identifiers onto wafers without contact. This method provides permanent, high-contrast markings without damaging the wafer. Our laser marking services offer clear and durable identification, facilitating superior inventory management and traceability. We support various marking needs, including logos, text, and complex codes.
To protect the wafer surface from down-stream processes, a layer of photoresist is often applied. This essential step ensures that sensitive areas remain intact during subsequent manufacturing stages. APD uses advanced photoresist application techniques to provide a robust shield against potential contaminants and physical damage, preserving the integrity of your wafers.
Our Die Pick & Place and Sort/Label process is a critical complement to the wafer dicing process, ensuring seamless integration in your workflow. APD offers meticulous die sorting, picking, placing, and labeling services to enhance your production efficiency. We guarantee precise handling and accurate labeling, improving traceability and streamlining your assembly line operations.
APD extends its capabilities through strategic partnerships, offering managed services that ensure comprehensive solutions. Our collaborations with industry-leading experts allow us to deliver exceptional results in areas such as wafer backgrinding and acquisition. By leveraging our partners' strengths, we provide a holistic approach to meet diverse needs, maintaining our commitment to quality and reliability.
Also known as thinning, wafer backgrinding is essential for achieving desired thickness in silicon wafers. APD's backgrinding services ensure uniform thickness and smooth surfaces, enhancing the performance and durability of your wafers. Our precision techniques minimize stress and damage, preserving the integrity of the wafers throughout the process.
Procuring the right wafer can be challenging, but APD simplifies this process. Our expert wafer acquisition services source high-quality wafers tailored to your specifications. Leveraging our extensive network and industry expertise, we find the best materials at competitive prices, reducing your procurement challenges and lead times.
We're here to help! If you have any questions or need further assistance, please don't hesitate to contact us. Our dedicated team is ready to provide you with the information and support you need. Reach out to us today, and let us help you achieve your goals.
Company Overview
APD is a fast turn wafer dicing service that has been providing services since 1999. We use precision mechanical dicing saws with diamond dicing blades to dice and machine a large variety of wafers made of various types and combinations of hard brittle materials.
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