APD has been a trusted provider of fast-turn wafer dicing services since 1999. Utilizing precision mechanical dicing saws equipped with diamond blades, we excel in dicing and machining a wide variety of wafers composed of diverse hard, brittle materials. Our expertise extends to silicon, glass, ceramics, sapphire, silicon carbide, and many other substrates.
APD stands out as the fastest wafer dicing service provider, offering rapid turnarounds that set us apart. For small jobs, we provide same-day quick turns with express delivery, ensuring fast service for those urgent projects. Local customers can even benefit from while-you-wait quick turns. Our speed, combined with precision, allows us to consistently meet the tightest deadlines.
Our clientele includes universities, R&D departments of major corporations, low to medium volume production operations, start-ups, and both private and federal research labs.
Explore our blog for detailed insights into our capabilities and process roadmap.
