About Us
We service Universities, R&D departments of large companies, low to medium volume production operations, start-ups and Research Labs (both Private and Federal). We do small to medium size jobs on a fast turn basis.
Check out our blog to get more info on our capabilities and process roadmap.
Speed
For urgent wafer dicing, we provide same-day service and assure next-day shipping with overnight delivery. Our skilled team, coupled with advanced cutting machines, ensures maximum
Value
When dicing wafers, speed and experience are essential factors in maximizing efficiency and accuracy with a high cutting speed to reduce costs. Experience operators who
Flexibility
Our company promises to offer customized solutions for each customer that fits their needs. We offer tailored solutions to meet the needs of our customers