Established in 1999, American Precision Dicing (APD) has been a trusted provider of fast-turn wafer dicing services. Located in San Jose, California, the heart of Silicon Valley, we leverage our prime location to stay at the forefront of technological advancements, ensuring our clients receive cutting-edge solutions.
Utilizing precision mechanical dicing saws equipped with diamond blades, we excel in dicing and machining a wide variety of wafers composed of diverse hard, brittle materials. Our expertise encompasses substrates such as silicon, glass, ceramics, sapphire, silicon carbide, and many others.
At APD, we pride ourselves on being the fastest wafer dicing service provider, offering rapid turnarounds that set us apart. For small jobs, we provide same-day quick turns with express delivery, ensuring fast service for urgent projects. Local customers can even benefit from while-you-wait quick turns. Our combination of speed and precision allows us to consistently meet the tightest deadlines.
Business Hours
Monday – Friday: 9:00 AM – 5:00 PM (PST)
Closed on weekends & major holidays.
Our diverse clientele includes universities, R&D departments of major corporations, low to medium volume production operations, start-ups, and both private and federal research labs.
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for detailed insights into our capabilities and process roadmap.
APD provides a diverse range of services, expertly developed in-house or managed in collaboration with our trusted long-term partners.
Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.
Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.
Optimizing wafer processing with meticulous sorting, pick & place, and labeling.
Utilizing advanced laser technology for precise and permanent serial number etching on wafers.
Safeguarding wafers with a photoresist layer during subsequent manufacturing steps.
Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.
Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.
At APD, we prioritize speed, value, and flexibility. These principles guide our commitment to delivering exceptional wafer dicing services, ensuring efficient, cost-effective, and customized solutions for our clients.
For urgent wafer dicing, we provide same-day service and assure next-day shipping with overnight delivery. Our skilled team, coupled with advanced cutting machines, ensures maximum efficiency.
When dicing wafers, speed and experience are essential factors in maximizing efficiency and accuracy with a high cutting speed to reduce costs.
Our company promises to offer customized solutions for each customer that fits their needs. We offer tailored solutions to meet the needs of our customers.
Our valued customers include leading companies, research labs, and universities who trust us for their wafer dicing and processing needs.
Company Overview
APD is a fast turn wafer dicing service that has been providing services since 1999. We use precision mechanical dicing saws with diamond dicing blades to dice, core, downsize and machine a large variety of wafers made of various types and combinations of hard brittle materials.
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