At APD, we specialize in processing a diverse range of materials to meet your unique requirements. Our expertise spans a wide variety of substrates, from common silicon wafers to specialized compounds and ceramics. Whether you're working with metals, semiconductors, or glass, our advanced capabilities ensure precision and quality at every step. Partner with us to leverage our cutting-edge technology and experienced team for all your material processing needs. Your project deserves the best, and at APD, we're committed to delivering exceptional results for every material we handle.
At APD, we process a wide variety of materials, and while we aim to keep our list comprehensive, it may not cover everything we can handle. If your material isn't listed, don’t hesitate to contact us—we likely have the expertise and capabilities to process it. Our team is happy to discuss your specific requirements and provide a tailored solution.
Company Overview
APD is a fast turn wafer dicing service that has been providing services since 1999. We use precision mechanical dicing saws with diamond dicing blades to dice, core, downsize and machine a large variety of wafers made of various types and combinations of hard brittle materials.
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