Our business hours are Monday – Friday, 9:00 AM – 5:00 PM (PST). We are closed on weekends and major holidays.

Our standard turnaround time is 3 to 5 business days, depending on job complexity, quantity, and current production queue. However, we offer expedited processing for urgent requests, including 48-hour, 24-hour, and even same-day service. For local customers, some jobs can even be completed while you wait in our lobby. Expedited services involve premium charges and are subject to availability. Please contact us with your specific requirements, and we’ll work to meet your deadlines.

Our material list covers a broad range of substrates, but it may not include everything we can process. If your material isn’t listed, contact us—there’s a good chance we can work with it. Our team is experienced in handling a variety of hard and brittle materials, and we’re always open to discussing your specific requirements.

Absolutely, clients are welcome to drop off wafers at our facility during designated business hours. Kindly coordinate with our team to ensure seamless reception.

Certainly! You are more than welcome to observe the dicing process. We believe in fostering transparency and trust with our clients, and we're happy to accommodate your interest in witnessing our meticulous work firsthand. Please let us know your preferences, and we'll make the necessary arrangements for your visit.

With our cutting-edge equipment, we consistently achieve precision down to the micron level, ensuring that we meet the exacting standards of our clients. Typically, we maintain an impressive accuracy of +/- 10 microns, showcasing our commitment to delivering top-notch results.

APD can handle a wide range of wafer sizes, up to 300 mm in diameter.

APD can make cuts as thin as 20 microns wide with high precision.

We can process wafers as thin as 50 microns.

We have successfully cut wafers up to 10 mm thick in the past, but this is not our limit. If you have thicker wafers, we may be able to accommodate your request depending on the material and requirements. Please provide details, and we’ll assess feasibility

Yes, APD can perform trenching with variations in depths of less than 5 micrometers over a 300-millimeter cut.

While not always mandatory, the use of photoresist is strongly recommended for optimal protection during the dicing process, particularly for delicate materials or when stringent cleanliness standards must be upheld.

Photoresist is advised for dicing applications where the material's integrity and cleanliness are paramount concerns, ensuring a protective layer against potential damage or contamination during the precision cutting process.

Chipping is measured using a calibrated microscope. Viewing the topside of the part, find the largest chip along the edge of the kerf. Measure the distance from the edge of the kerf to the top of the chip. Backside chipping is measured the same way, but the part has to be removed from the holding medium and flipped over to expose the backside.

Our pricing structure is tailored to the individual requirements of each project, accounting for factors such as wafer size, material composition, and specific service needs. Please reach out to us for a personalized quote.

Our payment terms are flexible and tailored to suit the specifics of each project. Please feel free to discuss your payment preferences with us, and we'll ensure a mutually agreeable arrangement. Typically, payment is required upon the completion of the project and before shipping. We're committed to ensuring transparency and clarity in all our transactions.

Absolutely, we're pleased to offer the convenience of credit card payments, alongside ACH payments, to ensure a seamless experience for our valued clients.

Unfortunately, we currently do not offer discounts specifically tailored to universities.