APD stands out as the fastest wafer dicing service in the industry, offering unmatched precision and efficiency. Whether you need same-day turnaround, while-you-wait service for local orders, or urgent express delivery, we ensure you get high-quality results in record time. Our state-of-the-art technology allows us to meet your tight deadlines without compromising on accuracy, making APD the premier choice for rapid wafer dicing solutions.
The technique of separating individual dies from a larger piece of semiconductor material (a wafer) is known as Wafer Dicing (or wafer scribing, or wafer cutting or die singulation). This term was created in the semiconductor industry to describe singulation of the individual die from the wafer.
Over the years, the APD dicing processes have evolved into something much broader that no longer fits the simple Wikipedia definition. Although we continue to process semiconductor wafers as our primary bread-and-butter product, a more precise categorization might be precision micromachining of hard, brittle materials.
Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.
Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.
Safeguarding wafers with a photoresist layer during subsequent manufacturing steps.
Optimizing wafer processing with meticulous sorting, pick & place, and labeling.
Utilizing advanced laser technology for precise and permanent serial number etching on wafers.
Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.
Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.
Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.
Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.
Safeguarding wafers with a photoresist layer during subsequent manufacturing steps.
Optimizing wafer processing with meticulous sorting, pick & place, and labeling.
Utilizing advanced laser technology for precise and permanent serial number etching on wafers.
Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.
Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.
The most requested wafer dicing process involves the dicing of silicon wafers and is performed by most wafer dicing companies. The APD engagement process is described below. This process can handle the dicing of silicon wafers and is flexible enough to include a broad range of precision manufacturing projects.
APD has provided exceptional wafer dicing services since 1999. Our experienced team, many with decades of tenure, ensures quality and reliability. The loyalty of our long-term customers speaks to our commitment to excellence.
For urgent wafer dicing, we provide same-day service and assure next-day shipping with overnight delivery. Our skilled team, coupled with advanced cutting machines, ensures maximum efficiency.
When dicing wafers, speed and experience are essential factors in maximizing efficiency and accuracy with a high cutting speed to reduce costs.
Our company promises to offer customized solutions for each customer that fits their needs. We offer tailored solutions to meet the needs of our customers
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WHAT OUR CUSTOMERS SAY
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The team at American Precision Dicing was very helpful and willing to work with me on my request. They informed me of their capabilities and proposed different dicing methods to achieve my request in a timely manner.
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For any kind of query, contact us with the details below.
Our business hours are Monday to Friday from 9 am to 5 pm.
Please feel free to email us anytime, and our team will do their best to respond promptly.
sales@wafer-dicing.com
Call us during business hours to discuss your project needs or to get more information about our services.
408-539-9880
Visit us at our office for a face-to-face consultation or to discuss your project requirements.
642 Giguere Ct, San Jose, CA 95133 U.S.A
Company Overview
APD is a fast turn wafer dicing service that has been providing services since 1999. We use precision mechanical dicing saws with diamond dicing blades to dice and machine a large variety of wafers made of various types and combinations of hard brittle materials.
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