Leading the Way in Semiconductor Solutions

 

Unmatched Speed and Precision in Wafer Dicing

 

APD stands out as the fastest wafer dicing service in the industry, offering unmatched precision and efficiency. Whether you need same-day turnaround, while-you-wait service for local orders, or urgent express delivery, we ensure you get high-quality results in record time. Our state-of-the-art technology allows us to meet your tight deadlines without compromising on accuracy, making APD the premier choice for rapid wafer dicing solutions.

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Leading the Way in Semiconductor Solutions


Unmatched Speed and Precision in Wafer Dicing

American Precision Dicing stands out as the fastest wafer dicing service provider in the industry, offering unmatched precision and efficiency. Whether you need same-day turnaround, while-you-wait service for local orders, or urgent express delivery, we ensure you get high-quality results in record time. Our state-of-the-art technology allows us to meet your tight deadlines without compromising on accuracy, making APD the premier choice for rapid wafer dicing solutions.
Learn More About APD

Who We Work With

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APD is the fastest wafer dicing provider globally, offering industry-leading quick-turn services. Our standard turnaround is 3-5 days, with options for 48-hour, 24-hour or even same-day service. For urgent needs, some jobs can be completed while you wait in our lobby. We ensure precision and speed to meet your most demanding deadlines.

What is wafer dicing?


The technique of separating individual dies from a larger piece of semiconductor material (a wafer) is known as Wafer Dicing (or wafer scribing, or wafer cutting or die singulation). This term was created in the semiconductor industry to describe singulation of the individual die from the wafer.


Over the years, the APD dicing processes have evolved into something much broader that no longer fits the simple Wikipedia definition. Although we continue to process semiconductor wafers as our primary bread-and-butter product, a more precise categorization might be precision micromachining of hard, brittle materials. 

Wafer Dicing Machine

Wafer Dicing Service

Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.

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Wafer Coring

Wafer Coring

Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.

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A wafer coated with photoresist on a black stand on a table

Photoresist

Safeguarding wafers with a photoresist layer during subsequent manufacturing steps.

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Die Sort, Pick & Place

Optimizing wafer processing with meticulous sorting, pick & place, and labeling.

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Laser Marking

Utilizing advanced laser technology for precise and permanent serial number etching on wafers.

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Wafer Dicing Service

Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.

More on this service

Wafer Coring

Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.

More on this service
Wafer Dicing Machine

Wafer Dicing Service

Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.

More on this service
Wafer Coring

Wafer Coring

Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.

More on this service
A wafer coated with photoresist on a black stand on a table

Photoresist

Safeguarding wafers with a photoresist layer during subsequent manufacturing steps.

More on this service

Die Sort, Pick & Place

Optimizing wafer processing with meticulous sorting, pick & place, and labeling.

More on this service

Laser Marking

Utilizing advanced laser technology for precise and permanent serial number etching on wafers.

More on this service

Wafer Dicing Service

Precision dicing of wafers is our core expertise, driven by decades of experience and technological innovation.

More on this service

Wafer Coring

Expert resizing of wafers to meet specific diameter requirements, ensuring optimal performance.

More on this service

Customer

Engagement

Process

The most requested wafer dicing process involves the dicing of silicon wafers and is performed by most wafer dicing companies. The APD engagement process is described below. This process can handle the dicing of silicon wafers and is flexible enough to include a broad range of precision manufacturing projects.

Customer Engagement
  • Project Communication: Communicate project details via email or phone.
  • Quote and Material Shipment: APD generates a quote, customer accepts it, and ships material to us.
  • Material Inspection: Receive and inspect material, contacting the customer if issues arise.
  • Production Documentation: Create documentation and send it to the production floor.
  • Production Process: Production manager reviews requirements, creates a plan, and will occasionally contact the customer.
  • Wafer Processing: Wafer undergoes surface protection (if needed), mounting, dicing, washing, QA inspection, packaging, and shipping. And the invoice is sent to the customer.

Customer Service

APD has provided exceptional wafer dicing services since 1999. Our experienced team, many with decades of tenure, ensures quality and reliability. The loyalty of our long-term customers speaks to our commitment to excellence.

Speed

Speed

For urgent wafer dicing, we provide same-day service and assure next-day shipping with overnight delivery. Our skilled team, coupled with advanced cutting machines, ensures maximum efficiency.

Value

Value

When dicing wafers, speed and experience are essential factors in maximizing efficiency and accuracy with a high cutting speed to reduce costs.


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Flexibility

Our company promises to offer customized solutions for each customer that fits their needs. We offer tailored solutions to meet the needs of our customers

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Client Reviews

WHAT OUR CUSTOMERS SAY

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Five Stars

The team at American Precision Dicing was very helpful and willing to work with me on my request. They informed me of their capabilities and proposed different dicing methods to achieve my request in a timely manner.

K.T.

Google

Five Stars

The service provided by American Precision Dicing was great! I'd recommend them for all your dicing needs.

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S.C.

Hewlett-Packard

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Five Stars

Very happy with APD’s service and technical assistance. Thanks!

 

S.K.

Apple

Five Stars

Absolutely fantastic team and people to work with. Professional and perfectly completed works.

B.N.

Zeiss

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Drop us a line

For any kind of query, contact us with the details below.
Our business hours are Monday to Friday from 9 am to 5 pm.

Email

 

Please feel free to email us anytime, and our team will do their best to respond promptly.

 

sales@wafer-dicing.com

Mail

Phone

 

Call us during business hours to discuss your project needs or to get more information about our services.

 

408-539-9880

Phone

Office

 

Visit us at our office for a face-to-face consultation or to discuss your project requirements.

 

642 Giguere Ct, San Jose, CA 95133 U.S.A

Location
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