What We Do
APD offers a number of services
Some of these services have been developed in-house, and others are managed with our long-time partners.
In-House Process
Wafer Dicing Service
Our wafer dicing service is our core competency and our passion.
Photoresist
In some cases, the wafer surface has to be protected from downstream processes by applying a layer of photoresist.
Die Sort, Pick, Place and Labeling
The Die Pick & Place and Sort/Label process complements the wafer dicing process.
Laser marking
Laser marking is a non-contact process that utilizes lasers to etch serial numbers onto wafers.
Wafer Coring
The process of coring (or resizing) a wafer to reduce its diameter can sometimes require additional processing.
Managed Services
Wafer Backgrinding
Wafer backgrinding, also known as thinning, removes material from the back of a silicon wafer to achieve a desired thickness.
Wafer Acquisition
Procuring the proper wafer to be processed can sometimes be very frustrating.
