APD performs wafer dicing of many different types of hard brittle materials such as:
- Acrylic
- Alumina
- Aluminum Nitride
- Aluminum-Titanium-Carbon
- Bismuth Telluride
- Borosilicate Glass
- Capton
- Ceramics
- Copper-NiP
- Copper-coated Alumina
- Crown Glass
- Ferrite
- FR-4
- Fused Silica
- Gallium Antimonide
- Gallium Arsenide (GaAs)
- Garnet
- Germanium
- Glass
- Graphite
- Inconel
- Lens Arrays
- Lithium-Niobate
- Lithium Tantalate
- Magnesium Discs
- Metallized Alumina
- Metallized Silicon
- Molybdenum
- Nickel
- Nickel Titanium
- Optic wafers
- Plastics
- Polymer
- Printed Circuit Boards
- Pyrex
- PZT
- Quartz
- QFN (Quad-Flat No-Leads)
- Resin
- Ruby
- Rutile Crystal
- Sapphire
- Silicon
- Silicon Carbide
- Silicon Dioxide
- Silicon Nitride
- Silicon with Glass
- Soda Lime Glass
- Solar Cells
- Stainless Steel
- Terbium
- Tungsten
- Yttrium Aluminium Garnet
- Yttrium Oxide
- Zinc Selenide
- Zirconia Ceramic
Request a Quote
This is only a partial list.
Please contact us for information on additional materials we can process for you.
Contact details
American Precision Dicing, Inc.
642 Giguere Court
San Jose, CA 95133-1737
Phone: (408) 254-1600
Fax: (408) 254-0999