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APD performs wafer dicing of many different types of hard brittle materials such as:

• Acrylic
• Alumina
• Aluminum Nitride
• Aluminum-Titanium-Carbon
• Beryllium
• Bismuth Telluride
• Borosilicate Glass
• Capton
• Ceramics
• Copper-NiP
• Copper-coated Alumina
• Crown Glass
• Ferrite
• FR-4
• Fused Silica
• Gallium Antimonide
• Gallium Arsenide (GaAs)
• Garnet
• Germanium
• Glass
• Graphite
• Inconel
• Lens Arrays
• Lithium-Niobate
• Lithium Tantalate
• Magnesium Discs
• Metallized Alumina
• Metallized Silicon
• Molybdenum

• Nickel
• Nickel Titanium
• Optic wafers
• Plastics
• Polymer
• Printed Circuit Boards
• Pyrex
• PZT
• Quartz
• QFN (Quad-Flat No-Leads)
• Resin
• Ruby
• Rutile Crystal
• Sapphire
• Silicon
• Silicon Carbide
• Silicon Dioxide
• Silicon Nitride
• Silicon with Glass
• Soda Lime Glass
• Solar Cellsv
• Stainless Steel
• Terbium
• Tungsten
• Yttrium Aluminium Garnet
• Yttrium Oxide
• Zinc Selenide
• Zirconia Ceramic