APD offers a number of services

Some of these services have been developed in-house, and others are managed with our long-time partners.

In-House Process

Wafer Dicing

We need to define some terms before we can explain our 300mm (12") dicing...

Photoresist

Protecting the surface of a wafer with a layer of photoresist ...

Die Sort, Pick, Place and Labeling

The Pick & Place Sort + Label process combines automation and logistics in..

Laser marking

Laser marking is a non-contact process that utilizes lasers to create permanent.

Wafer Coring

Coring (or resizing) a wafer to reduce its diameter ...

Managed Services

Back Grinding

Wafer backgrinding (or thinning) to reduce the thickness of the wafer ...

Wafer Acquisition

The technique of separating individual dies from a larger...