APD develops creative solutions to challenging micromachining problems, using precision diamond saws to cut and machine a large variety of hard brittle materials.
To complement our prototype focused processes, APD offers:
low to medium volume wafer dicing capacity as backup to current dicing processes
process development support for new product development
cost reduction solutions for products currently in production
make cuts as small as 25 microns wide
perform trenching with variations in depth to < 5 microns over a 4" cut
process wafers as thin as 50 microns
cut wafers as thick as 10 mm
handle wafers as large as 200 mm
cut die as small as 200 microns square
place cuts inside of cuts to create a custom trench profile
make standard entry cuts and plunge cuts
ship in waffle packs, gel packs and on tape & ring
Here are some specific applications where we have successfully applied our knowledge to provide cutting edge solutions.
Micromachining of 75 micron thick Nitinol wire. The wire was cut into 1.8 mm lengths and 3 notches were cut into the sides of the piece. The notches were 38 microns deep and 175 microns wide with 2 notches placed on the opposite side from the third.
Micromachining of various sizes of Nitinol springs and tubes.
Cutting of 750 micron diameter glass and ceramic tubes.
Cutting of custom sized microscope slides with delicate surface processing.
Sawing of 1/4" thick quartz photomask.
Sawing Silicon/Pyrex material with the blade slanted at 8 degrees.
Providing "near Polished" cuts to eliminate a polishing step for the end customer.
Delivering cut silicon pieces on non-tack tape to facilitate an automatic pick and place process.
Dicing of wafers with very fragile bumps.
Cutting and picking of die pieces from a 50 micron thi`ck wafer.
Placing high aspect ratio cuts in Ferrite toroids. (50 microns wide and 3.25 mm deep).
Precision routing of very small printed circuit boards from panels.
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