APD performs wafer dicing of many different types of hard brittle materials such as:

  • Acrylic
  • Alumina
  • Aluminum Nitride
  • Aluminum-Titanium-Carbon
  • Beryllium
  • Bismuth Telluride
  • Borosilicate Glass
  • Capton
  • Ceramics
  • Copper-NiP
  • Copper-coated Alumina
  • Crown Glass
  • Ferrite
  • FR-4
  • Fused Silica
  • Gallium Antimonide
  • Gallium Arsenide (GaAs)
  • Garnet
  • Germanium
  • Glass
  • Graphite
  • Inconel
  • Lens Arrays
  • Lithium-Niobate
  • Lithium Tantalate
  • Magnesium Discs
  • Metallized Alumina
  • Metallized Silicon
  • Molybdenum
  • Nickel
  • Nickel Titanium
  • Optic wafers
  • Plastics
  • Polymer
  • Printed Circuit Boards
  • Pyrex
  • PZT
  • Quartz
  • QFN (Quad-Flat No-Leads)
  • Resin
  • Ruby
  • Rutile Crystal
  • Sapphire
  • Silicon
  • Silicon Carbide
  • Silicon Dioxide
  • Silicon Nitride
  • Silicon with Glass
  • Soda Lime Glass
  • Solar Cellsv
  • Stainless Steel
  • Terbium
  • Tungsten
  • Yttrium Aluminium Garnet
  • Yttrium Oxide
  • Zinc Selenide
  • Zirconia Ceramic

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This is only a partial list.

Please contact us for information on additional materials we can process for you.